5962F0822801QYC
vs
XPC7451RX800SG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
AEROFLEX MICROELECTRONIC SOLUTIONS
MOTOROLA INC
Package Description
LGA, LGA484,22X22,50
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
32
JESD-30 Code
S-CBGA-N484
S-CBGA-B484
Number of Terminals
484
484
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
LGA
BGA
Package Equivalence Code
LGA484,22X22,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Speed
66 MHz
800 MHz
Supply Current-Max
1782 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Total Dose
300k Rad(Si) V
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Supply Voltage-Max
1.8 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.75 V