5962F0422903VZX
vs
5962F0422903QXC
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
LGA
|
|
| Package Description |
LGA,
|
GQFF, TPAK208,2.9SQ,20
|
| Pin Count |
484
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Combinatorial Delay of a CLB-Max |
1.01 ns
|
|
| JESD-30 Code |
S-CBGA-N484
|
S-XQFP-F208
|
| Length |
29 mm
|
|
| Number of CLBs |
1536
|
|
| Number of Equivalent Gates |
320640
|
|
| Number of Terminals |
484
|
208
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
1536 CLBS, 320640 GATES
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
LGA
|
GQFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, GUARD RING
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
2.95 mm
|
|
| Supply Voltage-Max |
2.7 V
|
|
| Supply Voltage-Min |
2.3 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Total Dose |
300k Rad(Si) V
|
300k Rad(Si) V
|
| Width |
29 mm
|
|
| Base Number Matches |
3
|
4
|
| Number of Inputs |
|
99
|
| Number of Logic Cells |
|
1536
|
| Number of Outputs |
|
99
|
| Package Equivalence Code |
|
TPAK208,2.9SQ,20
|
|
|
|
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