5962D9960701TUC
vs
5962L9960701QUC
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP,
|
|
| Pin Count |
36
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| JESD-30 Code |
R-CDFP-F36
|
R-XDFP-F36
|
| JESD-609 Code |
e4
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
|
| Number of Terminals |
36
|
36
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class T
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
3.048 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
10k Rad(Si) V
|
50k Rad(Si) V
|
| Width |
12.192 mm
|
|
| Base Number Matches |
4
|
4
|
| I/O Type |
|
COMMON
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
FL36,.5
|
| Standby Current-Max |
|
0.002 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.18 mA
|
|
|
|
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