5962D8956809VTX vs 5962-8956806VUX feature comparison

5962D8956809VTX Teledyne e2v

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5962-8956806VUX Temic Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
kg CO2e/kg 12.3 12.3
Average Weight (mg) 6890.8 6890.8
CO2e (mg) 84756.839 84756.839
Category CO2 Kg 12.3 12.3
Compliance Temperature Grade Military: -55C to +125C Military: -55C to +125C
Qualifications Rad Hard, Space Space
Access Time-Max 55 ns 55 ns
Cycle Time 70 ns 66.67 ns
JESD-30 Code R-CDIP-T28 R-CDIP-T28
Length 27.94 mm 27.94 mm
Memory Density 18432 bit 320 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 5
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 4096 words 4096 words
Number of Words Code 2000 64
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX9 64X5
Output Enable NO YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 3.94 mm 3.94 mm
Supply Current-Max 0.07 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 10k Rad(Si) V
Width 7.62 mm 7.62 mm
Base Number Matches 3 3

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