5962-9957401NUX
vs
XCV1000-6BGG560C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
560
560
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.8 ns
0.6 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
Length
42.5 mm
42.5 mm
Number of CLBs
6144
6144
Number of Equivalent Gates
1124022
1124022
Number of Terminals
560
560
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Organization
6144 CLBS, 1124022 GATES
6144 CLBS, 1124022 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class N
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Clock Frequency-Max
333 MHz
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Time@Peak Reflow Temperature-Max (s)
30
Compare 5962-9957401NUX with alternatives
Compare XCV1000-6BGG560C with alternatives