5962-9957401NUX vs XCV1000-5BG560I feature comparison

5962-9957401NUX AMD Xilinx

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XCV1000-5BG560I AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA-560
Pin Count 560 560
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.8 ns 0.7 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
Length 42.5 mm 42.5 mm
Number of CLBs 6144 6144
Number of Equivalent Gates 1124022 1124022
Number of Terminals 560 560
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 6144 CLBS, 1124022 GATES 6144 CLBS, 1124022 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38535 Class N
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Rohs Code No
Clock Frequency-Max 294 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Inputs 404
Number of Logic Cells 27648
Number of Outputs 404
Package Equivalence Code BGA560,33X33,50
Peak Reflow Temperature (Cel) 225
Terminal Finish Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) 30

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