5962-9800201KEA
vs
HCPL-177K#200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROPAC INDUSTRIES INC
AGILENT TECHNOLOGIES INC
Package Description
HERMETIC SEALED, CERAMIC, DIP-16
HERMETIC SEALED, DIP-16
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8541.40.80.00
8541.40.80.00
Additional Feature
HIGH RELIABILITY
OPEN COLLECTOR, HIGH RELIABILITY
Configuration
COMPLEX
COMPLEX
Forward Current-Max
0.01 A
0.01 A
Isolation Voltage-Max
1500 V
1500 V
JESD-609 Code
e0
e0
Mounting Feature
THROUGH HOLE MOUNT
THROUGH HOLE MOUNT
Number of Elements
4
4
Number of Functions
4
4
On-State Current-Max
0.04 A
0.04 A
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Optoelectronic Device Type
LOGIC IC OUTPUT OPTOCOUPLER
LOGIC IC OUTPUT OPTOCOUPLER
Power Dissipation-Max
0.05 W
0.05 W
Response Time-Nom
0.0001 ns
0.0001 ns
Supply Voltage-Min
2 V
2 V
Supply Voltage-Nom
18 V
18 V
Surface Mount
NO
NO
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Base Number Matches
1
1
Rohs Code
No
Data Rate-Nom
0.1 MBps
Compare 5962-9800201KEA with alternatives
Compare HCPL-177K#200 with alternatives