5962-9758001QEX
vs
MC54F109J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
F/FAST
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.56 mm
Logic IC Type
J-KBAR FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
70 MHz
Base Number Matches
4
4
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
70000000 Hz
Max I(ol)
0.02 A
Package Equivalence Code
DIP16,.3
Power Supplies
5 V
Power Supply Current-Max (ICC)
17 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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