5962-9669112HYC vs M68AF127BM55B6 feature comparison

5962-9669112HYC Micross Components

Buy Now

M68AF127BM55B6 STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP32,.6 0.600 INCH, PLASTIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-XDIP-T32 R-PDIP-T32
JESD-609 Code e4 e3
Length 41.91 mm 42.035 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP32,.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.1 mm 4.83 mm
Standby Current-Max 0.0015 A 0.0000045 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.15 mA 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code Yes

Compare 5962-9669112HYC with alternatives

Compare M68AF127BM55B6 with alternatives