5962-9562410HNC vs WS512K32-100G4TIE feature comparison

5962-9562410HNC Microsemi Corporation

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WS512K32-100G4TIE Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code QFP
Package Description QFF,
Pin Count 68
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 100 ns
Additional Feature CONFIGURABLE AS 2M X 8 CONFIGURABLE AS 512K X 32 OR 1024K X 16
Alternate Memory Width 16
JESD-30 Code S-XQFP-F68 S-CQMA-F68
JESD-609 Code e4 e4
Length 39.625 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 8
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 524288 words 2097152 words
Number of Words Code 512000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 512KX32 2MX8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code QFF
Package Shape SQUARE SQUARE
Package Style FLATPACK MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD GOLD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Width 39.625 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No

Compare 5962-9562410HNC with alternatives

Compare WS512K32-100G4TIE with alternatives