5962-9562409HNX
vs
AS8S512K32Q1-55L/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MERCURY SYSTEMS INC
MICROSS COMPONENTS
Package Description
QFF,
QFP,
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
55 ns
Additional Feature
CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
JESD-30 Code
S-XQFP-F68
S-CQFP-G68
Length
39.625 mm
22.352 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX32
512KX32
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-STD-883
Seated Height-Max
5.1 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
39.625 mm
22.352 mm
Base Number Matches
1
2
Compare 5962-9562409HNX with alternatives
Compare AS8S512K32Q1-55L/883 with alternatives