5962-9562409HNC
vs
5962-9559515HAC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
QFP
Package Description
QFF,
CERAMIC, QFP-68
Pin Count
68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
25 ns
Additional Feature
CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
JESD-30 Code
S-XQFP-F68
S-CQFP-G68
JESD-609 Code
e4
e4
Length
39.625 mm
22.355 mm
Memory Density
16777216 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX32
128KX32
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.1 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
GOLD
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
39.625 mm
22.36 mm
Base Number Matches
5
4
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP68,.99SQ,50
Standby Voltage-Min
2 V
Supply Current-Max
0.6 mA
Compare 5962-9562409HNC with alternatives
Compare 5962-9559515HAC with alternatives