5962-9561701MPA
vs
M95M01-DFCS6P/KF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP8,.3
|
WLCSP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
| Clock Frequency-Max (fCLK) |
12.5 MHz
|
16 MHz
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-GDIP-T8
|
R-PBGA-B8
|
| JESD-609 Code |
e0
|
|
| Length |
10.16 mm
|
2.578 mm
|
| Memory Density |
262144 bit
|
1048576 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
EEPROM
|
| Memory Width |
1
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
131072 words
|
| Number of Words Code |
256000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
256KX1
|
128KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
VBGA
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
GRID ARRAY, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
0.58 mm
|
| Standby Current-Max |
0.00005 A
|
|
| Supply Current-Max |
0.01 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
BALL
|
| Terminal Pitch |
2.54 mm
|
1 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
7.62 mm
|
1.716 mm
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Serial Bus Type |
|
SPI
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Write Cycle Time-Max (tWC) |
|
5 ms
|
|
|
|
Compare 5962-9561701MPA with alternatives
Compare M95M01-DFCS6P/KF with alternatives