5962-9559515H9X
vs
5962-9559507HNX
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MERCURY SYSTEMS INC
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE,
|
QFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
35 ns
|
| JESD-30 Code |
X-XUUC-N
|
S-CQFP-G68
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
128KX32
|
128KX32
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIE
|
QFP
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38534 Class H
|
MIL-STD-883
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
QUAD
|
| Base Number Matches |
5
|
4
|
| Length |
|
22.355 mm
|
| Number of Terminals |
|
68
|
| Seated Height-Max |
|
3.56 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
22.352 mm
|
|
|
|
Compare 5962-9559515H9X with alternatives
Compare 5962-9559507HNX with alternatives