5962-9559511HAX
vs
5962-3829411MYC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MATRA MHS
|
| Package Description |
QFP,
|
QCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
45 ns
|
| Additional Feature |
USER CONFIGURABLE AS 512K X 8
|
|
| JESD-30 Code |
S-CQFP-G68
|
R-CQCC-N32
|
| JESD-609 Code |
e4
|
e4
|
| Length |
22.36 mm
|
|
| Memory Density |
4194304 bit
|
65536 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
32
|
| Number of Words |
131072 words
|
8192 words
|
| Number of Words Code |
128000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
128KX32
|
8KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QCCN
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
5.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
22.36 mm
|
|
| Base Number Matches |
3
|
4
|
| Part Package Code |
|
QFJ
|
| Pin Count |
|
32
|
|
|
|
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