5962-9559509HXX
vs
5962-9559509HMA
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFF,
|
,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
20 ns
|
| Additional Feature |
USER CONFIGURABLE AS 128K X 32 OR 256K X 16
|
CONFIGURABLE AS 512K X 8
|
| JESD-30 Code |
S-CQFP-F68
|
S-CQMA-G68
|
| JESD-609 Code |
e4
|
e0
|
| Length |
39.6 mm
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
SRAM MODULE
|
CACHE SRAM MODULE
|
| Memory Width |
8
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
524288 words
|
131072 words
|
| Number of Words Code |
512000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512KX8
|
128KX32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
39.6 mm
|
|
| Base Number Matches |
6
|
8
|
| Alternate Memory Width |
|
16
|
|
|
|
Compare 5962-9559509HXX with alternatives
Compare 5962-9559509HMA with alternatives