5962-9559509HXC
vs
5962-9559509HNX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
AEROFLEX MICROELECTRONIC SOLUTIONS
|
AUSTIN SEMICONDUCTOR INC
|
Package Description |
QFF, QFL68,1.56SQ
|
QFP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
20 ns
|
20 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
S-XQFP-F68
|
S-CQFP-G68
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Terminals |
68
|
68
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
128KX32
|
128KX32
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFP
|
Package Equivalence Code |
QFL68,1.56SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
MIL-PRF-38534
|
Standby Current-Max |
0.0116 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.6 mA
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
7
|
4
|
Part Package Code |
|
QFP
|
Pin Count |
|
68
|
JESD-609 Code |
|
e4
|
Length |
|
22.355 mm
|
Number of Functions |
|
1
|
Seated Height-Max |
|
3.56 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Terminal Finish |
|
PALLADIUM GOLD
|
Width |
|
22.352 mm
|
|
|
|
Compare 5962-9559509HXC with alternatives
Compare 5962-9559509HNX with alternatives