5962-9559509HNA vs 5962-9559509HYA feature comparison

5962-9559509HNA Micross Components

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5962-9559509HYA Cobham Advanced Electronic Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code QFP
Package Description CERAMIC, QFP-68
Pin Count 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
I/O Type COMMON COMMON
JESD-30 Code S-CQFP-G68 S-XQFP-F68
JESD-609 Code e0
Length 22.355 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1
Number of Terminals 68 68
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX32 128KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code QFP QFF
Package Equivalence Code QFP68,1.1SQ,50 QFL68,1.56SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Seated Height-Max 3.56 mm
Standby Current-Max 0.0116 A 0.0116 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.6 mA 0.6 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 22.352 mm
Base Number Matches 4 8

Compare 5962-9559509HNA with alternatives

Compare 5962-9559509HYA with alternatives