5962-9559508HBA
vs
WS128K32-25G1TCA
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
Package Description |
QFP,
|
23.90 MM, 4.06 MM HEIGHT, CERAMIC, QFP-68
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
25 ns
|
25 ns
|
JESD-30 Code |
S-CQFP-G68
|
S-CQFP-G68
|
JESD-609 Code |
e0
|
|
Length |
23.875 mm
|
23.88 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
128KX32
|
128KX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
4.06 mm
|
4.06 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
23.88 mm
|
23.88 mm
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
No
|
Additional Feature |
|
USER CONFIGURABLE AS 512K X 8
|
Alternate Memory Width |
|
16
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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