5962-9558201QFA vs 933373210652 feature comparison

5962-9558201QFA Lansdale Semiconductor Inc

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933373210652 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DFP SOIC
Package Description DFP, FL16,.3 SOP,
Pin Count 16 24
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature USABLE AS 1 TO 8 DEMULTIPLEXER
Family TTL/H/L 4000/14000/40000
Input Conditioning STANDARD LATCHED
JESD-30 Code R-CDFP-F16 R-PDSO-G24
JESD-609 Code e0
Logic IC Type 2-LINE TO 4-LINE DECODER 4-LINE TO 16-LINE DECODER
Max I(ol) 0.016 A
Number of Functions 1 1
Number of Terminals 16 24
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE INVERTED
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DFP SOP
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Power Supply Current-Max (ICC) 35 mA
Prop. Delay@Nom-Sup 30 ns
Propagation Delay (tpd) 32 ns 550 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Supply Voltage-Max (Vsup) 5.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code Yes
Length 15.4 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.65 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

Compare 5962-9558201QFA with alternatives

Compare 933373210652 with alternatives