5962-9468301MPA
vs
HFA1110IJ
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP8,.3
DIP-8
Pin Count
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
BUFFER
BUFFER
Bandwidth (3dB)-Nom
750 MHz
750 MHz
Bias Current-Max (IIB) @25C
40 µA
40 µA
Input Offset Voltage-Max
25000 µV
35000 µV
JESD-30 Code
R-CDIP-T8
R-GDIP-T8
JESD-609 Code
e0
e0
Neg Supply Voltage Limit-Max
-6 V
-6 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Current-Min
0.05 A
0.05 A
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Slew Rate-Min
800 V/us
Slew Rate-Nom
800 V/us
1300 V/us
Supply Voltage Limit-Max
6 V
6 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Average Bias Current-Max (IIB)
65 µA
Supply Current-Max
33 mA
Compare 5962-9468301MPA with alternatives
Compare HFA1110IJ with alternatives