5962-9466904Q9X vs SM320C40GFS60 feature comparison

5962-9466904Q9X Texas Instruments

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SM320C40GFS60 Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code DIE PGA
Package Description DIE, SPGA, SPGA325,35X35MOD
Pin Count 352 325
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 31 31
Barrel Shifter YES YES
Boundary Scan YES YES
Clock Frequency-Max 60 MHz 60 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code X-XUUC-N352 S-CPGA-P325
Low Power Mode YES YES
Number of Terminals 352 325
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE SPGA
Package Shape UNSPECIFIED SQUARE
Package Style UNCASED CHIP GRID ARRAY, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form NO LEAD PIN/PEG
Terminal Position UPPER PERPENDICULAR
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
Bit Size 32
Integrated Cache YES
Length 47.245 mm
Number of DMA Channels 6
Number of Timers 2
Package Equivalence Code SPGA325,35X35MOD
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (words) 8192
ROM (words) 4G
Seated Height-Max 5.08 mm
Supply Current-Max 850 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 47.245 mm

Compare 5962-9466904Q9X with alternatives

Compare SM320C40GFS60 with alternatives