5962-9461113HTC vs WS512K32N-55G4TIA feature comparison

5962-9461113HTC Microsemi Corporation

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WS512K32N-55G4TIA Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code PGA QFP
Package Description PGA, 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Pin Count 66 68
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 55 ns
JESD-30 Code S-CPGA-P66 S-CQFP-F68
JESD-609 Code e4 e0
Length 27.305 mm 39.6 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 66 68
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 512KX32 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA QFF
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 4.5974 mm 3.56 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD TIN LEAD
Terminal Form PIN/PEG FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 27.305 mm 39.6 mm
Base Number Matches 5 3
Pbfree Code No
Rohs Code No
Additional Feature USER CONFIGURABLE AS 2M X 8
Alternate Memory Width 16

Compare 5962-9461113HTC with alternatives

Compare WS512K32N-55G4TIA with alternatives