5962-9461107HTX
vs
AS8S512K32P-35L/IT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
WHITE MICROELECTRONICS
MICROSS COMPONENTS
Package Description
CERAMIC, HIP-66
PGA, PGA68,11X11
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
USER CONFIGURABLE AS 2M X 8
TTL COMPATIBLE INPUTS/OUTPUTS
Alternate Memory Width
16
JESD-30 Code
S-CHIP-P66
S-CPGA-P66
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX32
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Base Number Matches
7
1
Pbfree Code
Rohs Code
Part Package Code
PGA
Pin Count
66
I/O Type
COMMON
JESD-609 Code
e0
Length
27.305 mm
Output Characteristics
3-STATE
Package Code
PGA
Package Equivalence Code
PGA68,11X11
Seated Height-Max
4.5974 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
2 V
Supply Current-Max
0.57 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
27.305 mm
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