5962-9318717HXX
vs
P4C1256-20TILF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
AEROFLEX PLAINVIEW
PYRAMID SEMICONDUCTOR CORP
Part Package Code
PGA
TSOP
Package Description
HIP,
8 X 13.40 MM, ROHS COMPLIANT, PLASTIC, TSOP-28
Pin Count
66
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
17 ns
20 ns
JESD-30 Code
S-XHIP-P66
R-PDSO-G28
Length
30.1 mm
11.811 mm
Memory Density
4194304 bit
262144 bit
Memory IC Type
CACHE SRAM MODULE
STANDARD SRAM
Memory Width
32
8
Number of Functions
1
1
Number of Terminals
66
28
Number of Words
131072 words
32768 words
Number of Words Code
128000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
128KX32
32KX8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HIP
TSOP1
Package Shape
SQUARE
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
6.22 mm
1.1938 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
0.55 mm
Terminal Position
HEX
DUAL
Width
30.1 mm
8.001 mm
Base Number Matches
2
1
Pbfree Code
Yes
Rohs Code
Yes
JESD-609 Code
e3
Supply Current-Max
0.165 mA
Terminal Finish
MATTE TIN
Compare 5962-9318717HXX with alternatives
Compare P4C1256-20TILF with alternatives