5962-9318714HNC
vs
CYM1838HG-35MB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AEROFLEX MICROELECTRONIC SOLUTIONS
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-XPGA-P66
S-CPGA-P66
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
8
Number of Terminals
66
66
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX32
512KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA66,11X11
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.6 mA
0.72 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Base Number Matches
3
1
Rohs Code
Part Package Code
PGA
Package Description
1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
Pin Count
66
Additional Feature
CONFIGURABLE AS 128K X 32
JESD-609 Code
e0
Number of Functions
1
Number of Ports
1
Output Enable
YES
Seated Height-Max
8.128 mm
Standby Current-Max
0.04 A
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
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