5962-9318709HXX
vs
WS512K32L-25G2TMA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
WHITE MICROELECTRONICS
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
25 ns
Additional Feature
USER CONFIGURABLE AS 128K X 32
USER CONFIGURABLE AS 2M X 8
Alternate Memory Width
8
16
JESD-30 Code
S-CHIP-P66
S-CQFP-G68
Memory Density
4194304 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
32
Number of Functions
1
1
Number of Terminals
66
68
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256K16
512KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
GULL WING
Terminal Position
HEX
QUAD
Base Number Matches
3
2
Package Description
CERAMIC, QFP-68
Package Code
QFP
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