5962-9318708HUC
vs
P4C1256-25TI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
PYRAMID SEMICONDUCTOR CORP
|
| Part Package Code |
PGA
|
TSOP
|
| Package Description |
HIP,
|
8 X 13.40 MM, PLASTIC, TSOP-28
|
| Pin Count |
66
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| JESD-30 Code |
S-XHIP-P66
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e0
|
| Length |
30.1 mm
|
11.811 mm
|
| Memory Density |
4194304 bit
|
262144 bit
|
| Memory IC Type |
CACHE SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
66
|
28
|
| Number of Words |
131072 words
|
32768 words
|
| Number of Words Code |
128000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
128KX32
|
32KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HIP
|
TSOP1
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535
|
|
| Seated Height-Max |
5.84 mm
|
1.1938 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.55 mm
|
| Terminal Position |
HEX
|
DUAL
|
| Width |
30.1 mm
|
8.001 mm
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Supply Current-Max |
|
0.16 mA
|
|
|
|
Compare 5962-9318708HUC with alternatives
Compare P4C1256-25TI with alternatives