5962-9318708HMA
vs
5962-9318715HMC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
Part Package Code |
PGA
|
|
Package Description |
HIP,
|
|
Pin Count |
66
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
25 ns
|
JESD-30 Code |
S-XHIP-P66
|
S-XPGA-P66
|
JESD-609 Code |
e0
|
|
Length |
27.3 mm
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
CACHE SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
|
Number of Terminals |
66
|
66
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
128KX32
|
128KX32
|
Package Body Material |
UNSPECIFIED
|
CERAMIC
|
Package Code |
HIP
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
IN-LINE
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535
|
38535Q/M;38534H;883B
|
Seated Height-Max |
4.09 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
HEX
|
PERPENDICULAR
|
Width |
27.3 mm
|
|
Base Number Matches |
3
|
3
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
PGA66,11X11
|
Standby Voltage-Min |
|
2 V
|
Supply Current-Max |
|
0.6 mA
|
|
|
|
Compare 5962-9318708HMA with alternatives