5962-9318701HUX
vs
DPS128C32BV3-35M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WHITE MICROELECTRONICS
TWILIGHT TECHNOLOGY INC
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
120 ns
35 ns
Additional Feature
USER CONFIGURABLE AS 128K X 32
CONFIGURABLE AS 512K X 8
Alternate Memory Width
16
16
JESD-30 Code
S-CHIP-P66
S-CPGA-P66
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX8
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
IN-LINE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
HEX
PERPENDICULAR
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
PGA
Package Description
PGA,
Pin Count
66
Package Code
PGA
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
7.62 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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