5962-9317703MXX
vs
5962-9317702VTC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP,
DIP-28
Pin Count
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
30 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
30 ns
40 ns
JESD-30 Code
R-GDIP-T28
R-XDIP-T28
Length
37.1475 mm
27.94 mm
Memory Density
147456 bit
147456 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX9
16KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
5.84 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
3
3
Rohs Code
Clock Frequency-Max (fCLK)
25 MHz
JESD-609 Code
e4
Memory IC Type
OTHER FIFO
Package Equivalence Code
DIP28,.3
Supply Current-Max
0.15 mA
Terminal Finish
Gold (Au)
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