5962-9317702QZX
vs
5962D9317709VNX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
TELEDYNE E2V (UK) LTD
Reach Compliance Code
unknown
unknown
Access Time-Max
30 ns
30 ns
Cycle Time
40 ns
40 ns
JESD-30 Code
R-CDFP-F28
R-XDFP-F28
Length
18.288 mm
Memory Density
147456 bit
147456 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX9
16KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.3 mm
3.3 mm
Supply Current-Max
0.15 mA
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Part Package Code
DFP
Package Description
DFP,
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.32.00.71
Screening Level
MIL-PRF-38535 Class V
Total Dose
10k Rad(Si) V
Compare 5962-9317702QZX with alternatives
Compare 5962D9317709VNX with alternatives