5962-9315704HYC
vs
DPS256S8BN-70C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
WHITE MICROELECTRONICS
TWILIGHT TECHNOLOGY INC
Package Description
DIP-32
DIP, DIP32,.6
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-XDIP-T32
R-CDMA-T32
JESD-609 Code
e4
Length
41.525 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256KX8
256KX8
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
4
2
Pbfree Code
Rohs Code
Part Package Code
MODULE
Pin Count
32
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.0005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.16 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-9315704HYC with alternatives
Compare DPS256S8BN-70C with alternatives