5962-9315702HXA vs WS256K8-100CC feature comparison

5962-9315702HXA Microsemi Corporation

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WS256K8-100CC White Electronic Designs Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Package Description DIP, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 100 ns 100 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
JESD-609 Code e0 e0
Memory Density 2097152 bit 2097152 bit
Memory IC Type MULTI-PORT SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256KX8 256KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code No
Additional Feature TTL COMPATIBLE INPUTS AND OUTPUTS; BATTERY BACK-UP
I/O Type COMMON
Length 42.4 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP32,.6
Seated Height-Max 5.1 mm
Standby Current-Max 0.001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.07 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-9315702HXA with alternatives

Compare WS256K8-100CC with alternatives