5962-9300701MXX
vs
5962-9300701MXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
INTERSIL CORP
Package Description
,
PGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
Clock Frequency-Max
20 MHz
20 MHz
External Data Bus Width
8
8
JESD-30 Code
S-CPGA-P84
Low Power Mode
NO
NO
Number of Terminals
84
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Data Bus Width
20
20
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, CONVOLVER
DSP PERIPHERAL, CONVOLVER
Base Number Matches
3
3
Part Package Code
PGA
Pin Count
84
JESD-609 Code
e0
Length
28.0416 mm
Seated Height-Max
4.445 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
28.0416 mm
Compare 5962-9300701MXX with alternatives
Compare 5962-9300701MXC with alternatives