5962-9221503MRA
vs
IDT54FCT273ATLB
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
E2V TECHNOLOGIES PLC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, CERDIP-20
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
FCT
|
FCT
|
| JESD-30 Code |
R-GDIP-T20
|
R-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
24.13 mm
|
8.89 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
8
|
1
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP20,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
8.3 ns
|
8.3 ns
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883 Class B
|
| Seated Height-Max |
5.08 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
8.89 mm
|
| Base Number Matches |
7
|
2
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.032 A
|
| Power Supply Current-Max (ICC) |
|
16.3 mA
|
| Prop. Delay@Nom-Sup |
|
8.3 ns
|
|
|
|
Compare 5962-9221503MRA with alternatives