5962-9220504MLX
vs
5962-9220502MLA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
24
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Boundary Scan
NO
NO
Clock Frequency-Max
12.5 MHz
6.25 MHz
External Data Bus Width
16
16
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
32.005 mm
32.005 mm
Low Power Mode
NO
NO
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Data Bus Width
8
8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
21.8 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
7.62 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, PIPELINE REGISTER
DSP PERIPHERAL, PIPELINE REGISTER
Base Number Matches
2
3
JESD-609 Code
e0
Package Equivalence Code
DIP24,.3
Terminal Finish
TIN LEAD
Compare 5962-9220504MLX with alternatives
Compare 5962-9220502MLA with alternatives