5962-9200401MPA
vs
HFA1100MJ/883
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
INTERSIL CORP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
CURRENT-FEEDBACK
CURRENT-FEEDBACK
Bias Current-Max (IIB) @25C
15 µA
50 µA
Frequency Compensation
YES
YES
Input Offset Voltage-Max
12000 µV
6000 µV
JESD-30 Code
R-GDIP-T8
R-GDIP-T8
JESD-609 Code
e0
e0
Low-Bias
NO
NO
Low-Offset
NO
NO
Micropower
NO
NO
Neg Supply Voltage Limit-Max
-7 V
-6 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Min
1000 V/us
1850 V/us
Supply Current-Max
6.4 mA
33 mA
Supply Voltage Limit-Max
7 V
6 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Wideband
YES
YES
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Part Package Code
DIP
Pin Count
8
Common-mode Reject Ratio-Nom
46 dB
Slew Rate-Nom
2300 V/us
Compare 5962-9200401MPA with alternatives
Compare HFA1100MJ/883 with alternatives