5962-9169702MXX
vs
5962-9169702MXA
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
DIP, DIP40,.6
|
Pin Count |
40
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
|
Address Bus Width |
16
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
16 MHz
|
|
DAC Channels |
NO
|
|
DMA Channels |
NO
|
|
External Data Bus Width |
8
|
|
JESD-30 Code |
R-CDIP-T40
|
R-XDIP-T40
|
Number of I/O Lines |
32
|
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
PWM Channels |
NO
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
OTPROM
|
UVPROM
|
Speed |
16 MHz
|
16 MHz
|
Supply Voltage-Max |
6 V
|
|
Supply Voltage-Min |
4 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
Base Number Matches |
4
|
6
|
Rohs Code |
|
No
|
CPU Family |
|
8051
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP40,.6
|
RAM (bytes) |
|
256
|
ROM (words) |
|
32768
|
Screening Level |
|
38535Q/M;38534H;883B
|
Supply Current-Max |
|
45 mA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb) - hot dipped
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
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