5962-9169702MXX vs 5962-9169702MXA feature comparison

5962-9169702MXX NXP Semiconductors

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5962-9169702MXA Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP, DIP40,.6
Pin Count 40
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO
Address Bus Width 16
Bit Size 8 8
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
JESD-30 Code R-CDIP-T40 R-XDIP-T40
Number of I/O Lines 32
Number of Terminals 40 40
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
PWM Channels NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability OTPROM UVPROM
Speed 16 MHz 16 MHz
Supply Voltage-Max 6 V
Supply Voltage-Min 4 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Base Number Matches 4 6
Rohs Code No
CPU Family 8051
JESD-609 Code e0
Package Equivalence Code DIP40,.6
RAM (bytes) 256
ROM (words) 32768
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 45 mA
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped
Terminal Pitch 2.54 mm

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