5962-9161701MXA
vs
IDT70V25L55PFI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
CERAMIC, PGA-84
TQFP-100
Reach Compliance Code
unknown
not_compliant
Access Time-Max
70 ns
55 ns
JESD-30 Code
S-CPGA-P84
S-PQFP-G100
JESD-609 Code
e0
e0
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
84
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX16
8KX16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
PIN/PEG
GULL WING
Terminal Position
PERPENDICULAR
QUAD
Base Number Matches
5
1
Pbfree Code
Part Package Code
QFP
Pin Count
100
ECCN Code
EAR99
HTS Code
8542.32.00.41
I/O Type
COMMON
Length
14 mm
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Peak Reflow Temperature (Cel)
240
Seated Height-Max
1.6 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
3 V
Supply Current-Max
0.17 mA
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
Compare 5962-9161701MXA with alternatives
Compare IDT70V25L55PFI with alternatives