5962-9157601MQA
vs
TSC87C52-25CJ
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TELEFUNKEN MICROELECTRONICS GMBH
|
Package Description |
DIP, DIP40,.6
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
JESD-30 Code |
R-XDIP-T40
|
R-XDIP-T40
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
DIP40,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
UVPROM
|
UVPROM
|
Screening Level |
38535Q/M;38534H;883B
|
|
Speed |
12 MHz
|
25 MHz
|
Supply Current-Max |
35 mA
|
36.25 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb) - hot dipped
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
3
|
Has ADC |
|
NO
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
25 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
NO
|
On Chip Program ROM Width |
|
8
|
PWM Channels |
|
NO
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|