5962-9150806MXA
vs
7006S55PFG8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
DEFENSE LOGISTICS AGENCY
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
CAVITY-UP, CERAMIC, PGA-68
TQFP-64
Reach Compliance Code
unknown
compliant
Access Time-Max
45 ns
55 ns
Additional Feature
INTERRUPT FLAG; ARBITER; SEMAPHORE
JESD-609 Code
e0
e3
Length
29.464 mm
14 mm
Memory Density
131072 bit
131072 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX8
16KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
PGA
LQFP
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.207 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
PIN/PEG
GULL WING
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
PERPENDICULAR
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
29.464 mm
14 mm
Base Number Matches
3
2
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.41
JESD-30 Code
S-PQFP-G64
Number of Terminals
64
Package Shape
SQUARE
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Compare 7006S55PFG8 with alternatives