5962-9150805MYA
vs
7006L55PFG8
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Package Description |
QFP-68
|
TQFP-64
|
Reach Compliance Code |
not_compliant
|
compliant
|
Access Time-Max |
45 ns
|
55 ns
|
Additional Feature |
INTERRUPT FLAG; ARBITER; SEMAPHORE
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
S-XQFP-F68
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
e3
|
Length |
24.0792 mm
|
14 mm
|
Memory Density |
131072 bit
|
131072 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
|
Number of Terminals |
68
|
64
|
Number of Words |
16384 words
|
16384 words
|
Number of Words Code |
16000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
16KX8
|
16KX8
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
LQFP
|
Package Equivalence Code |
QFL68,.95SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Qualified
|
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
3.683 mm
|
1.6 mm
|
Standby Current-Max |
0.03 A
|
|
Standby Voltage-Min |
4.5 V
|
|
Supply Current-Max |
0.4 mA
|
0.25 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.0792 mm
|
14 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare 5962-9150805MYA with alternatives
Compare 7006L55PFG8 with alternatives