5962-9080306MLA vs 27HC641L-45/SP feature comparison

5962-9080306MLA QP Semiconductor

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27HC641L-45/SP Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description DIP, 0.300 INCH, SKINNY, PLASTIC, DIP-24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
JESD-30 Code R-GDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 31.877 mm 34.67 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.06 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 24
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Standby Current-Max 0.0001 A
Supply Current-Max 0.107 mA

Compare 5962-9080306MLA with alternatives

Compare 27HC641L-45/SP with alternatives