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5962-9071504MUX vs L8C204PC50 feature comparison

5962-9071504MUX Cypress Semiconductor

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L8C204PC50 LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
Memory Density 36864 bit 36864 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX9 4KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Rohs Code No
Additional Feature RETRANSMIT
Length 35.052 mm
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.572 mm
Supply Current-Max 0.08 mA
Terminal Pitch 2.54 mm
Width 7.62 mm
Memory » FIFOs
Memory » FIFOs

Compare 5962-9071504MUX with alternatives

Compare L8C204PC50 with alternatives