5962-9065801JX vs WS57C43C-25D feature comparison

5962-9065801JX Waferscale Integration Inc

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WS57C43C-25D Waferscale Integration Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WAFERSCALE INTEGRATION INC WAFERSCALE INTEGRATION INC
Package Description CERAMIC, DIP-24 0.600 INCH, CERDIP-24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 70 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Standby Current-Max 0.035 A 0.03 A
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Length 32.135 mm
Seated Height-Max 5.72 mm
Terminal Finish Tin/Lead (Sn/Pb)
Width 15.24 mm

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