5962-9062501MRA vs TD74BC244P feature comparison

5962-9062501MRA Texas Instruments

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TD74BC244P Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, CERAMIC, DIP-20 DIP,
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
Count Direction UNIDIRECTIONAL
Family BCT/FBT BCT/FBT
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 24.195 mm 24.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Number of Bits 4 4
Number of Functions 8 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 80 mA 27 mA
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 6 ns 6.8 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BICMOS BICMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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