5962-9056403XA
vs
5962-9056403XX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP40,.6
|
DIP,
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
| JESD-609 Code |
e0
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
40
|
40
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
|
| ROM (words) |
16384
|
|
| ROM Programmability |
EEPROM
|
EEPROM
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
45 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-9056403XA with alternatives
Compare 5962-9056403XX with alternatives