5962-8993501XA vs 5962-9461113HTX feature comparison

5962-8993501XA Pyramid Semiconductor Corporation

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5962-9461113HTX Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MICROSEMI CORP
Part Package Code DIP PGA
Package Description DIP, DIP28,.3 PGA,
Pin Count 28 66
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 35 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE
JESD-30 Code R-GDIP-T28 S-CPGA-P66
JESD-609 Code e0 e0
Length 37.0205 mm 27.305 mm
Memory Density 262144 bit 16777216 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 4 32
Number of Functions 1 1
Number of Terminals 28 66
Number of Words 65536 words 524288 words
Number of Words Code 64000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX4 512KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP PGA
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Seated Height-Max 5.08 mm 4.5974 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 7.62 mm 27.305 mm
Base Number Matches 3 5

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Compare 5962-9461113HTX with alternatives