5962-8986302YA
vs
5962-8986302YX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28
DIP,
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
65 ns
65 ns
Cycle Time
80 ns
80 ns
JESD-30 Code
R-XDIP-T28
R-XDIP-T28
JESD-609 Code
e0
e0
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512X9
512X9
Output Enable
NO
NO
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883
Supply Current-Max
0.115 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare 5962-8986302YA with alternatives
Compare 5962-8986302YX with alternatives